Ebyuma ebikozesebwa mu byuma ebikubibwa .

Ebyuma ebikozesebwa mu byuma ebikubibwa .

 

Precision Plasma Surface Treatment for Printed Electronics & Ebyuma ebikyukakyuka .

Enzijanjaba ya plasma ey’omulembe esobozesa okutumbula okunyweza okwesigika ku substrates enzibu ezikozesebwa mu:

  • Circuits ezikubibwa ezikyukakyuka (FPCs) - zikola polyimide (PI) ne PET films for conductive ink bonding .
  • OLED/LCD eraga {- pre-Okulongoosa ennukuta ya ultra-egiraasi egonvu (UTFG) n'ebizigo bya ITO .
  • Battery ezigonvu-Firimu - Enkola y'okungulu ey'okukola kwa Li-Ebipande by'obusannyalazo .

 

Okusoomozebwa

Ekigonjoola kya Plasma .

Omugaso gw'ebyekikugu .

Ebiwujjo by’amasoboza amatono eby’okungulu .

Oxygen/Argon/Plasma eyingiza ebibinja bya hydroxyl (-OH) & carboxyl (-COOH) .

Okukendeeza ku nkoona okuva ku 80℃→30℃mu .<1s

Okufulumya-Ebikozesebwa mu kukwata .

Pulsed DBD Plasma ku .<50°C prevents thermal damage

Enkyukakyuka ya nanoscale ( .<10nm depth) only

Okugwa kw'okunywerera ku UTFG .

DCSBD plasma eggyawo hydrocarbons ate nga eyongerako oxygen functionalities .

10⁵× Okukendeeza ku buziyiza mu Circuits za RGO .

 

 
 
Ebikozesebwa-Ebigambo ebitongole .
  • Firimu za Polyimide (Kapton®) .

Enkola: N2/H2 Plasma ku 20khz, 7KV

Ekivaamu: Okukwatagana kwa yinki okusingawo ebitundu 60% vs. obujjanjabi bwa Corona .

 

  • ultra-Endabirwamu egonvu (UTFG)

Enkola: Okusaasaana kw’ekiziyiza eky’okungulu kwa coplanar (DCSBD) .

Ekivaamu: 40% okutambuza okweyongera mu PEDOT:PSS coatings .

 

  • LI-Ekipande ky'obusannyalazo .

Enkola: Plasma y’empewo nga erina HE/O2

Ekyavaamu: Amaanyi g’ebikuta agasingako ebitundu 15% mu butoffaali obulimu laminated .

 

  • Yinginiya-Ebyokugonjoola ebyetegefu okufuluma-Ebikozesebwa Ebikulu .

Enkola zaffe zigatta ddala -Okulondoola impedansi y’ekiseera n’okufuga amaanyi agakwatagana n’okuziyiza arcing ku:

Ebbugumu-Ebiwuka ebiwulize -Ebiwuka ebiyitibwa polymers (okugeza, PLGA scaffolds) .

Micro-Ebitundu bya ITO ebikoleddwa .

Ebyapa bya bbaatule ebirimu obutuli .

 

  • Tuukirira ttiimu yaffe eya Surface Engineering ku:

▶︎ Alipoota y’okugezesa okukwatagana kw’ebintu (nga mw’otwalidde n’ebiwandiiko bya WCA/SEM/XPS) .

▶︎ Okukakasa enkola ne substrates zo (PI/COP/PEN) .

▶︎ ON-Okulongoosa kwa parameter mu kifo okuziyiza okwonooneka kw'okufulumya .